Materials

BROWSE MATERIALS
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  • ACI-995 Alumina is widely used in industrial and engineering applications because of its high-performance and purity. Alumina oxide is chosen for its strength, stiffness, and resistance to corrosion, as well as its electrical insulation and high thermal conductivity. Common shapes are disks, rings rectangles and custom designs requiring high specifications and tolerance. 

    ACI-995 Alumina

    Properties Units AC998 Aluminum Oxide 99.5% Aluminum Oxide
    MECHANICAL
    Density g/cm3 3.9 3.8-3.9
    Color - ivory ivory/white
    Water Absorption % 0 0
    Flexural Strength MPa@room temp.(R.T.)

    400

    310-379
    Compressive Strength MPa@R.T. 3180 2070-2620
    Hardness GPa 14.0-15.0 13.8-17.6
    THERMAL
    Coefficient of Linear Thermal Expansion 1E-6/°C (»25°C to Ј1000°C) 8.0 9.0-9.4
    Thermal Conductivity W/m°K@R.T. 29.5 25.1-35.6
    Specific Heat cal/g°C@R.T. 0.21 0.19-0.21
    Thermal Shock Resistance D T(°C) 250 200
    Maximum Use Temperature °C 1800 1600-1750
    ELECTRICAL
    Volume Resistivity Ohm. cm@R.T. >1014 >1014
    Dielectric Constant 1MHz@R.T. 9.8 9.6-10.2
  • ACI-998 Alumina is widely used in industries like semiconductor, automotive, oil and gas energy, medical and health, military defense, and armor industries. It is used for its high electrical insulation property, sound mechanical performance, and excellent corrosion resistance.

    ACI-998 Alumina

    Properties Units ACI-998 Alumina (weight 99.8% Aluminum Oxide) 99.5% Aluminum Oxide
    MECHANICAL
    Density gram/cm3 3.9 3.8-3.9
    Color - ivory ivory/white
    Water Absorption % 0 0
    Flexural Strength MPa@room temp.(R.T.) 400 310-379
    Compressive Strength MPa@R.T. 3180 2070-2620
    Hardness GPa 14.0-15.0 13.8-17.6
    THERMAL
    Coefficient of Linear Thermal Expansion 1E-6/°C (»25°C to Ј1000°C) 8.0 9.0-9.4
    Thermal Conductivity W/m°K@R.T. 29.5 25.1-35.6
    Specific Heat cal/g°C@R.T. 0.21 0.19-0.21
    Thermal Shock Resistance D T(°C) 250 200
    Maximum Use Temperature °C 1800 1600-1750
    ELECTRICAL
    Volume Resistivity Ohm. cm@R.T. >1014 >1014
    Dielectric Constant 1MHz@R.T. 9.8 9.6-10.2
  • Aluminum 6061

    Properties Units Aluminum 6061
    MECHANICAL
    Density g/cm3 2.70
    Color - light gray
    Water Absorption % 0
    Flexural Strength MPa@room temp.(R.T.) -
    Compressive Strength MPa@R.T. -
    Hardness GPa »11
    THERMAL
    Coefficient of Linear Thermal Expansion 1E-6/°C (»25°C to Ј1000°C) 21-23
    Thermal Conductivity W/m°K@R.T. 153-180
    Specific Heat cal/g°C@R.T. -
    Thermal Shock Resistance D T(°C) -
    Maximum Use Temperature °C 540
    ELECTRICAL
    Volume Resistivity Ohm. cm@R.T. 2.6x10-6
    Dielectric Constant 1MHz@R.T. -
  • Aluminum Nitride (ACI-AlN) is is used for a variety of electronic applications that demand both high thermal conductivity and electrical insulation. Aluminum Nitride also has a low toxicity, and can remove heat being used in heat sinks and spreaders, and AlN can be used as a trusted substance in semiconductor products. Common shapes are blocks, sheets, rings, and bars.

    Aluminum Nitride

    Properties Units Aluminum Nitride
    MECHANICAL
    Density g/cm3 3.19-3.25
    Color - gray
    Water Absorption % 0
    Flexural Strength MPa@room temp.(R.T.) 428
    Compressive Strength MPa@R.T. -
    Hardness GPa 10.4-11.7
    THERMAL
    Coefficient of Linear Thermal Expansion 1E-6/°C (»25°C to Ј1000°C) 4.6-5.7
    Thermal Conductivity W/m°K@R.T. 100-115
    Specific Heat cal/g°C@R.T. -
    Thermal Shock Resistance D T(°C) 400
    Maximum Use Temperature °C 1600
    ELECTRICAL
    Volume Resistivity Ohm. cm@R.T. >1014
    Dielectric Constant 1MHz@R.T. 8.0-9.0
  • Celazole

    Properties Units Celazole
    MECHANICAL
    Density g/cm3 1.30
    Color - black
    Water Absorption % 0.0-0.4
    Flexural Strength MPa@room temp.(R.T.)

    221

    Compressive Strength MPa@R.T. 400
    Hardness GPa -
    THERMAL
    Coefficient of Linear Thermal Expansion 1E-6/°C (»25°C to Ј1000°C) (»25°C to Ј1000°C) 13 (through 150°C)
    Thermal Conductivity

    W/m°K@R.T.

    0.4
    Specific Heat cal/g°C@R.T. -
    Thermal Shock Resistance D T(°C) -
    Maximum Use Temperature °C 345-540
    ELECTRICAL
    Volume Resistivity Ohm. cm@R.T. >1013
    Dielectric Constant 1MHz@R.T. -
  • Pyrolytic Graphite is a form of graphite with a high level of diamagnetism (ability to repel or be repelled in a magnetic field). Graphite is made from crystalline carbon, is used because of its very high thermal resistance and conductivity, and can be machined into blocks, rings, and majority of different shapes.

    Graphite

    Properties Units Graphite
    MECHANICAL
    Density g/cm3 1.57-1.88
    Color - black
    Water Absorption % 0.5-3.0
    Flexural Strength MPa@room temp.(R.T.) 50
    Compressive Strength MPa@R.T. 96
    Hardness GPa 8.5
    THERMAL
    Coefficient of Linear Thermal Expansion 1E-6/°C (»25°C to Ј1000°C) 8.39
    Thermal Conductivity W/m°K@R.T. 95.6
    Specific Heat cal/g°C@R.T. 0.16-0.38
    Thermal Shock Resistance D T(°C) 200-250
    Maximum Use Temperature °C -
    ELECTRICAL
    Volume Resistivity Ohm. cm@R.T. 0.45-1.00x10-3
    Dielectric Constant 1MHz@R.T. -
  • Macor

    Properties Units Macor
    MECHANICAL
    Density g/cm3 2.52-2.63
    Color - white
    Water Absorption % 0
    Flexural Strength MPa@room temp.(R.T.)

    89

    Compressive Strength MPa@R.T. 345
    Hardness GPa 2.5
    THERMAL
    Coefficient of Linear Thermal Expansion 1E-6/°C (»25°C to Ј1000°C) 6.3-9.7
    Thermal Conductivity

    W/m°K@R.T.

    1.8
    Specific Heat cal/g°C@R.T. -
    Thermal Shock Resistance D T(°C) -
    Maximum Use Temperature °C 950-1000
    ELECTRICAL
    Volume Resistivity Ohm. cm@R.T. >1014
    Dielectric Constant 1MHz @R.T. 6.0
  • Pyrex

    Properties Units Pyrex
    MECHANICAL
    Density g/cm3 2.23
    Color - white/transparent
    Water Absorption % 0
    Flexural Strength MPa@room temp.(R.T.) -
    Compressive Strength MPa@R.T. -
    Hardness GPa 4.1
    THERMAL
    Coefficient of Linear Thermal Expansion 1E-6/°C (»25°C to Ј1000°C) 3.25 (through 300°C)
    Thermal Conductivity W/m°K@R.T. 1.1
    Specific Heat cal/g°C@R.T. 0.18
    Thermal Shock Resistance D T(°C) 100
    Maximum Use Temperature °C 230-490
    ELECTRICAL
    Volume Resistivity Ohm. cm@R.T. -
    Dielectric Constant 1MHz@R.T. 4.6
  • Quartz

    Properties Units Quartz
    MECHANICAL
    Density g/cm3 2.2
    Color - white/transparent
    Water Absorption % 0
    Flexural Strength MPa@room temp.(R.T.) 80
    Compressive Strength MPa@R.T. 650-1100
    Hardness GPa 11.5-13.5
    THERMAL
    Coefficient of Linear Thermal Expansion 1E-6/°C (»25°C to Ј1000°C) 0.55
    Thermal Conductivity W/m°K@R.T. 1.4
    Specific Heat cal/g°C@R.T. 0.16
    Thermal Shock Resistance D T(°C) -
    Maximum Use Temperature °C 1200
    ELECTRICAL
    Volume Resistivity Ohm. cm@R.T. 7x107
    Dielectric Constant 1MHz@R.T. 3.75
  • Sapphire is a synthetic form of aluminum oxide in a crystal structure, and its extreme hardness, which is transparent allowing light to pass through in a wide range of waveforms – makes it ideal as a window or display requiring shatter-proof capabilities. Sapphire is also very durable and wear resistant making it great for surgical and industrial cleaning equipment.

    Sapphire

    Properties Units Sapphire
    MECHANICAL
    Density g/cm3 3.97
    Color - White / transparent
    Water Absorption % 0
    Flexural Strength MPa@room temp.(R.T.) 760-1035
    Compressive Strength MPa@R.T. 2000
    Hardness GPa 18.5-21.5
    THERMAL
    Coefficient of Linear Thermal Expansion 1E-6/°C (»25°C to Ј1000°C) 7.9-8.8
    Thermal Conductivity W/m°K@R.T. 40
    Specific Heat cal/g°C@R.T. 0.18
    Thermal Shock Resistance D T(°C) -
    Maximum Use Temperature °C 2000
    ELECTRICAL
    Volume Resistivity Ohm. cm@R.T. 10 16
    Dielectric Constant 1MHz@R.T. 9.3-11.5
  • Silicon comes in monocrystalline and polycrystalline forms, and is used as a primary base for silicone microchips and semiconductors in most electronics. The material is stable, reliable, high-performing, and affordable which is why its used in many electronics and solar cell industries.

    Silicon

    Properties Units Silicon
    MECHANICAL
    Density g/cm3 2.33
    Color - gray
    Water Absorption % 0
    Flexural Strength MPa@room temp.(R.T.) -
    Compressive Strength MPa@R.T. -
    Hardness GPa 11.3
    THERMAL
    Coefficient of Linear Thermal Expansion 1E-6/°C (»25°C to Ј1000°C) 2.3-2.6
    Thermal Conductivity W/m°K@R.T. 125
    Specific Heat cal/g°C@R.T. 0.18
    Thermal Shock Resistance D T(°C) -
    Maximum Use Temperature °C 1350
    ELECTRICAL
    Volume Resistivity Ohm. cm@R.T. 0.005->20
    Dielectric Constant 1MHz@R.T. 11.7
  • Silicon Carbide

    Properties Units Silicon Carbide
    MECHANICAL
    Density g/cm3 3.08-3.20
    Color - black
    Water Absorption % 0
    Flexural Strength MPa@room temp.(R.T.) 462
    Compressive Strength MPa@R.T. 1725-2500
    Hardness GPa 23.5-24.5
    THERMAL
    Coefficient of Linear Thermal Expansion 1E-6/°C (»25°C to Ј1000°C) 4.0-4.5
    Thermal Conductivity W/m°K@R.T. 75-155
    Specific Heat cal/g°C@R.T. 0.15
    Thermal Shock Resistance D T(°C) 350-500
    Maximum Use Temperature °C 1400
    ELECTRICAL
    Volume Resistivity Ohm. cm@R.T. 108
    Dielectric Constant 1MHz@R.T. -
  • Silicon Nitride

    Properties Units Silicon Nitride
    MECHANICAL
    Density g/cm3 3.18-3.30
    Color - gray
    Water Absorption % 0
    Flexural Strength MPa@room temp.(R.T.) 338-590
    Compressive Strength MPa@R.T. -
    Hardness GPa 13.2-14.7
    THERMAL
    Coefficient of Linear Thermal Expansion 1E-6/°C (»25°C to Ј1000°C) 2.5-3.5
    Thermal Conductivity W/m°K@R.T. 15-30
    Specific Heat cal/g°C@R.T. 0.17
    Thermal Shock Resistance D T(°C) 500-670
    Maximum Use Temperature °C 1200-1400
    ELECTRICAL
    Volume Resistivity Ohm. cm@R.T. 1012
    Dielectric Constant 1MHz@R.T. -
  • Stainless Steel 316

    Properties Units Stainless Steel 316
    MECHANICAL
    Density g/cm3 8.08
    Color - silver gray
    Water Absorption % 0
    Flexural Strength MPa@room temp.(R.T.) -
    Compressive Strength MPa@R.T. -
    Hardness GPa »19
    THERMAL
    Coefficient of Linear Thermal Expansion 1E-6/°C (»25°C to Ј1000°C) 17.5
    Thermal Conductivity W/m°K@R.T. 16.2
    Specific Heat cal/g°C@R.T. 0.12
    Thermal Shock Resistance D T(°C) -
    Maximum Use Temperature °C 900
    ELECTRICAL
    Volume Resistivity Ohm. cm@R.T. 7.4x10-6
    Dielectric Constant 1MHz@R.T. -
  • Vespel

    Properties Units Vespel
    MECHANICAL
    Density g/cm3 -
    Color - brown
    Water Absorption % -
    Flexural Strength MPa@room temp.(R.T.) -
    Compressive Strength MPa@R.T. -
    Hardness GPa -
    THERMAL
    Coefficient of Linear Thermal Expansion 1E-6/°C (»25°C to Ј1000°C) 30
    Thermal Conductivity W/m°K@R.T. -
    Specific Heat cal/g°C@R.T. -
    Thermal Shock Resistance D T(°C) -
    Maximum Use Temperature °C 288-482
    ELECTRICAL
    Volume Resistivity Ohm. cm@R.T. >1014
    Dielectric Contact 1MHz@R.T. 3.55
  • Zirconia

    Properties Units Zirconia
    MECHANICAL
    Density g/cm3 5.79-6.05
    Color - ivory
    Water Absorption % 0
    Flexural Strength MPa@room temp.(R.T.) 900-980
    Compressive Strength MPa@R.T. -
    Hardness GPa 11.0-12.7
    THERMAL
    Coefficient of Linear Thermal Expansion 1E-6/°C (»25°C to Ј1000°C) 9.2-10.3
    Thermal Conductivity W/m°K@R.T. 2.2-3.8
    Specific Heat cal/g°C@R.T. 0.12
    Thermal Shock Resistance D T(°C) 280-360
    Maximum Use Temperature °C 2400
    ELECTRICAL
    Volume Resistivity Ohm. cm@R.T. -
    Dielectric Constant 1MHz@R.T. -

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